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CPU天梯图 2024
Intel CPU 挤牙膏进度 2008-2024
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硬盘天梯图 2024
Qualcomm Snapdragon 821 CPU天梯图 单核 性能 参数 多核 跑分 排名
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内容型号Qualcomm Snapdragon 821GeekBench6 单核跑分393GeekBench6 多核跑分799安兔兔跑分265896发布时间2016品牌Qualcomm是否有 核显带有核显GPU核显Adreno 530类型Mobile/Embedded最主频GHz2.3总核心4l1cache64L2缓存1024 KBTDP功耗(W)11nm144gLTE Cat. 125gNowifi5bluetooth4.1videoCodecsH.264, H.265, VP8, VP9navigationGPS, GLONASS, Beidou, GalileomodemX12支持主板ARMv8-ACPU介绍Qualcomm Snapdragon 821 – an 4-core chipset that was announced on August 16, 2016, and is manufactured using a 14-nanometer process technology. It has 2 cores Kryo at 2342 MHz and 2 cores Kryo at 1600 MHz.viewCount1325创建时间2023-12-10 05:37:39修改时间2025-08-28 04:58:04